SEM defect review and classification for semiconductor device manufacturing

Zamir Abraham

doi:10.1117/12.429352

5 June 2001 SEM defect review and classification for semiconductor device manufacturing

Zamir Abraham

Proceedings Volume 4275, Metrology-based Control for Micro-Manufacturing; (2001) https://doi.org/10.1117/12.429352
Event: Photonics West 2001 - LASE, 2001, San Jose, CA, United States

Abstract

Manufacturing of semiconductor devices is an extremely complicated, time consuming, multi-stage process. In order to maintain acceptable yield levels, the production line must be continuously monitored. Scanning Electron Microscopes (SEMs) are employed by all advanced wafer fabrication lines (fabs) for imaging and review of sub- micron defects which may result in faulty circuits. Designed to greatly enhance the functions of a defect review SEM, the Applied Materials SEMVision cX^TM is a fully automated defect review and classification system, that is able to generate a novel type of defect image, and to use the information in these images for automatic defect classification. A unique technology that was developed for this purpose is Multiple Perspective SEM Imaging (MPSI^TM), an electron detection method in which multiple detectors that differ in their spectral and spatial response, are employed such that multiple images (perspectives) containing complementary information are generated simultaneously.

Citation Download Citation

Zamir Abraham "SEM defect review and classification for semiconductor device manufacturing", Proc. SPIE 4275, Metrology-based Control for Micro-Manufacturing, (5 June 2001); https://doi.org/10.1117/12.429352

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