Paper
10 August 2001 Effect of stress on defect transformation in hydrogen-implanted silicon and SOI structures
Irina V. Antonova, Vladimir P. Popov, Jadwiga Bak-Misiuk, J. Domagala, Andrzej Misiuk, V. I. Obodnikov, A. K. Gutakovskii, A. Romano-Rodriguez
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Abstract
Transformation of defects in hydrogen implanted silicon and silicon-on-insulator structures caused by external pressure of argon ambient at the stage of defect removal in implanted material and high temperature annealing SOI structures is reported. The results are compared to these for crystals annealed at argon atmosphere of ambient pressure. Formation of the new phase crystallites was found in SOI structures annealed at high temperature in conditions of high pressure. Small insulations were also observed in hydrogen implanted silicon, which can be patterns of the new phase. Two reasons can cause phase transformation in the top silicon layer of as-bonded SOI structures: high hydrogen concentration and high local strain.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Irina V. Antonova, Vladimir P. Popov, Jadwiga Bak-Misiuk, J. Domagala, Andrzej Misiuk, V. I. Obodnikov, A. K. Gutakovskii, and A. Romano-Rodriguez "Effect of stress on defect transformation in hydrogen-implanted silicon and SOI structures", Proc. SPIE 4412, International Conference on Solid State Crystals 2000: Growth, Characterization, and Applications of Single Crystals, (10 August 2001); https://doi.org/10.1117/12.435812
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KEYWORDS
Silicon

Hydrogen

Crystals

Annealing

Argon

Diffraction

Interfaces

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