Paper
15 October 2001 Surface-acoustic-wave device-based wireless measurement platform for sensors
Han Tao, Wenkang Shi
Author Affiliations +
Proceedings Volume 4601, Micromachining and Microfabrication Process Technology and Devices; (2001) https://doi.org/10.1117/12.444700
Event: International Symposium on Optoelectonics and Microelectronics, 2001, Nanjing, China
Abstract
In some applications, a wireless readout is necessary because of the difficulty of fixed connection between sensors and signal processing unit. The current wireless sensor systems based on data modulation are limited by battery duration and special environment. Wireless surface acoustic wave (SAW) sensors could be used for sensing some physical and chemical measurand passively. However, it is necessary to design SAW sensor specifically in different applications. In this paper, a wireless measurement platform based on SAW technology for sensors is studied. According to the coupling of modes (COM) theory, the reflection magnitude and phase of an interdigital transducer (IDT) is a function of a complex termination impedance at its electrical port and thus conventional sensors varying in impedance can be easily upgraded into wireless sensors. A delay-line SAW device with low insertion loss is designed with the help of a COM model. In order to overcoming the drawback, which evaluates sensor information by amplitude measurement of reflected impulses, the reflection phase is measured using a digital quadrature demodulation unit. This novel wireless measurement platform is applied in weigh measuring with capacitive sensor and the performance of wireless system is given.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Han Tao and Wenkang Shi "Surface-acoustic-wave device-based wireless measurement platform for sensors", Proc. SPIE 4601, Micromachining and Microfabrication Process Technology and Devices, (15 October 2001); https://doi.org/10.1117/12.444700
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Cited by 2 scholarly publications.
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