Laser-material processing: an industrial view of packaging applications

James H. Brannon

doi:10.1117/12.470654

18 June 2002 Laser-material processing: an industrial view of packaging applications

James H. Brannon

Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002) https://doi.org/10.1117/12.470654
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States

Abstract

In the past two decades, laser applications in the packaging of microelectronics and photonics have clearly made a mark in industrial processing. With the commercial availability of reliable UV and IR lasers, a wealth of techniques and methods have evolved: generation of vias, high resolution patterning of materials by etching and ablation, laser bonding and micro welding, stripping of insulation and cladding, deposition of conductors, creation of surface microstructures, cleaning of sensitive surfaces, and a variety of drilling, slicing, and dicing processes. The list goes on and on, and what new techniques may evolve is limited only by human ingenuity. In this presentation we will review several of these applications with particular emphasis on those that are industrially useful. Many interesting concepts in laser processing fill the pages of scientific and engineering journals, but few of these ideas are seriously considered for a manufacturing environment. In conclusion, we will attempt to answer just what makes an industrially successful laser process.

Citation Download Citation

James H. Brannon "Laser-material processing: an industrial view of packaging applications", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); https://doi.org/10.1117/12.470654

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