Water-jet guided laser: possibilities and potential for singulation of electronic packages

Frank Ruediger Wagner; Akos Spiegel; Nandor Vago; Bernold Richerzhagen

doi:10.1117/12.470656

18 June 2002 Water-jet guided laser: possibilities and potential for singulation of electronic packages

Frank Ruediger Wagner, Akos Spiegel, Nandor Vago, Bernold Richerzhagen

Proceedings Volume 4637, Photon Processing in Microelectronics and Photonics; (2002) https://doi.org/10.1117/12.470656
Event: High-Power Lasers and Applications, 2002, San Jose, California, United States

Abstract

Singulation of packages is an important step in the manufacturing of IC devices. Presently, the most widely used technique is abrasive sawing. Due to the combination of different materials used in packages such as copper and mold compound, the saw rapidly blunts and also conventional laser cutting by a water-jet with the high precision and speed of a laser cut and is now applied into electronic package singulation.

Citation Download Citation

Frank Ruediger Wagner, Akos Spiegel, Nandor Vago, and Bernold Richerzhagen "Water-jet guided laser: possibilities and potential for singulation of electronic packages", Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); https://doi.org/10.1117/12.470656

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