Novel technique for microscopic imaging (quality control) of silicon wafers

Vladislav V. Yakovlev; Katerina Mikhailchenko; Michael Ravkin

doi:10.1117/12.460188

8 March 2002 Novel technique for microscopic imaging (quality control) of silicon wafers

Vladislav V. Yakovlev, Katerina Mikhailchenko, Michael Ravkin

Proceedings Volume 4664, Machine Vision Applications in Industrial Inspection X; (2002) https://doi.org/10.1117/12.460188
Event: Electronic Imaging, 2002, San Jose, California, United States

Abstract

We propose and experimentally demonstrate a fluorescent imaging technique for surface quality control of wet-cleaned silicon wafers. This simple technique allows macro- and microscopic imaging. Submicron resolution and fast scanning are successfully demonstrated. Distribution of water stains is measured using this novel technique and correlated to the surface structure.

Citation Download Citation

Vladislav V. Yakovlev, Katerina Mikhailchenko, and Michael Ravkin "Novel technique for microscopic imaging (quality control) of silicon wafers", Proc. SPIE 4664, Machine Vision Applications in Industrial Inspection X, (8 March 2002); https://doi.org/10.1117/12.460188

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