Integration of a network solver and a field solver for the mixed-level thermal simulation of MEMS problems

Marta Rencz; Vladimir Szekely; Andras Poppe

doi:10.1117/12.462840

19 April 2002 Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems

Marta Rencz, Vladimir Szekely, Andras Poppe

Author Affiliations +

Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462840
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France

Abstract

The paper presents an algorithm for the thermal simulation of MEMS problems for the cases when certain parts of the MEMS structure are given with their detailed structural description while others are given with the RC network compact models. The presented co-siumulation algorithm enables fast simulation in the frequency or in the time domain, and can be a very useful extension of any kind of field solvers. The thermal simulation of a hot-plate problem demonstrates the advantages and the simpli8city of the method.

Citation Download Citation

Marta Rencz, Vladimir Szekely, and Andras Poppe "Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462840

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