Productivity and OPC reticle inspectability using multibeam UV wavelength inspection

Mark R. Laurance; Dino Hsieh; Vincent Wen

doi:10.1117/12.479354

16 August 2002 Productivity and OPC reticle inspectability using multibeam UV wavelength inspection

Mark R. Laurance, Dino Hsieh, Vincent Wen

Proceedings Volume 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents; (2002) https://doi.org/10.1117/12.479354
Event: 18th European Mask Conference on Mask Technology for Integrated Circuits and Micro-Components, 2002, Munich-Unterhaching, Germany

Abstract

In order to extend the life of DUV lithography to the 130 nm design rule and below, optical proximity correction (OPC) and phase shift masks (PSM) have become increasingly common. The implementation of low k lithography in IC production requires inspection systems with smaller linewidth capability and higher sensitivity to obtain high yields in advanced reticle production. This paradigm presents greater inspection challenges for current UV tools. When inspections are run on advanced reticles on current tools, the number of false and nuisance defect detections are so high as to make inspecting these reticles unmanageable. The amount of desense required to bring false and nuisance detections down also causes real defects to be missed. The TeraStar SLF27 is the next generation reticle inspection tool from KLA-Tencor. The TeraStar addresses these problems with new algorithms that allow inspection of OPC features without desensing the detectors. Complementing this are triple-beam optics and the ability to run pattern and STARlight inspections concurrently giving a net gain in the throughput and productivity of the tool. Here we present the first results from the use of the TeraStar in a production environment.

Citation Download Citation

Mark R. Laurance, Dino Hsieh, and Vincent Wen "Productivity and OPC reticle inspectability using multibeam UV wavelength inspection", Proc. SPIE 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (16 August 2002); https://doi.org/10.1117/12.479354

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available