Laser micromachining in the microelectronics industry

Yunlong Sun; Edward J. Swenson

doi:10.1117/12.482886

12 September 2002 Laser micromachining in the microelectronics industry

Yunlong Sun, Edward J. Swenson

Proceedings Volume 4915, Lasers in Material Processing and Manufacturing; (2002) https://doi.org/10.1117/12.482886
Event: Photonics Asia, 2002, Shanghai, China

Abstract

The use of lasers in microelectronics production for trimming, link cutting, ablating, drilling and general “micromachining” continues to grow. Several new technologies, such as alternative wavelength processing and shaped, uniform laser spots have produced better processing quality, higher reliability, and greater yields. This paper will review the latest technologies of laser micro-machining in microelectronics. Laser drilling for printed circuit board will be dressed in another paper.

Citation Download Citation

Yunlong Sun and Edward J. Swenson "Laser micromachining in the microelectronics industry", Proc. SPIE 4915, Lasers in Material Processing and Manufacturing, (12 September 2002); https://doi.org/10.1117/12.482886

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