Understanding the operating expense relationships of layouts on excimer photo tools

Dennis B. Ames

doi:10.1117/12.485273

2 July 2003 Understanding the operating expense relationships of layouts on excimer photo tools

Dennis B. Ames

Proceedings Volume 5043, Cost and Performance in Integrated Circuit Creation; (2003) https://doi.org/10.1117/12.485273
Event: Advanced Microelectronic Manufacturing, 2003, Santa Clara, CA, United States

Abstract

Chip size as a function of field fill on wafer layouts, and their effect on thruput, has been well understood as a loss of both opportunity and cost of operation (COO), as a function of depreciated capital expense. The resultant effects on consumable replacement time, expense and budgeting has not been as clear-cut. This paper will outline the consequences that field fill has with respect to increased laser, and litho tool optic train, consumable usages as well as availability detractors to replace these components. Resulting losses due to increased cost of operation, and additional consumable spending and usages will be explored.

Citation Download Citation

Dennis B. Ames "Understanding the operating expense relationships of layouts on excimer photo tools", Proc. SPIE 5043, Cost and Performance in Integrated Circuit Creation, (2 July 2003); https://doi.org/10.1117/12.485273

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