Laser processing at solid-liquid interfaces using femtosecond pulse laser sources

Kenji Katayama; Hideaki Yonekubo; Tsuguo Sawada

doi:10.1117/12.540531

18 November 2003 Laser processing at solid-liquid interfaces using femtosecond pulse laser sources

Kenji Katayama, Hideaki Yonekubo, Tsuguo Sawada

Proceedings Volume 5063, Fourth International Symposium on Laser Precision Microfabrication; (2003) https://doi.org/10.1117/12.540531
Event: Fourth International Symposium on Laser Precision Microfabrication, 2003, Munich, Germany

Abstract

Laser processing using light sources with ultrashort pulses was applied to solid/liquid interfaces. A single-shot 200-fs pulse light was simply focused and irradiated or two pulses were interfered and irradiated at a water or electrolyte solution/silicon interface. From the measured AFM images on the processed silicon surfaces, several features were revealed, which were characteristic of the laser processing at the solid/liquid interface. First, ring patterns surrounded by sinusoidal patterns like ripples were found within the irradiated spot. Secondly, the processed depth was reduced by coexisting electrolyte in water. Thirdly, there were less residual aggregates or debris.

Citation Download Citation

Kenji Katayama, Hideaki Yonekubo, and Tsuguo Sawada "Laser processing at solid-liquid interfaces using femtosecond pulse laser sources", Proc. SPIE 5063, Fourth International Symposium on Laser Precision Microfabrication, (18 November 2003); https://doi.org/10.1117/12.540531

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