Integrated thermoelectric cooler/package for infrared detector array temperature stabilization

John M. Zamboni

doi:10.1117/12.509779

8 December 2003 Integrated thermoelectric cooler/package for infrared detector array temperature stabilization

John M. Zamboni

Proceedings Volume 5209, Materials for Infrared Detectors III; (2003) https://doi.org/10.1117/12.509779
Event: Optical Science and Technology, SPIE's 48th Annual Meeting, 2003, San Diego, California, United States

Abstract

Thermoelectric Coolers (TEC's) are reversible heat pumps which can be employed for cooling and/or temperature stabilization of critical electronic circuits which might become in-operable without removal of the heat generated within the device. Thermoelectric temperature stabilization is often used in uncooled Infrared imaging systems due to the temperature sensitive nature of the detector array. These Infrared systems operate in environments where the ambient temperature changes. The TEC is used to either heat or cool the detector array to its optimized temperature. The integrated TEC concept involves soldering of individual thermoelectric elements directly in the base of the package. The package is made from metallized multi-layer ceramic which includes electrical pins for both the TEC and the detector array. Integrating the cooler directly into the package offers many advantages. It reduces the number of piece parts in the system, the number of soldering or bonding operations, allows for a higher temperature assembly, and eliminates the TEC mounting operation for detector manufacturers. The integrated TEC can be designed to meet operative parameters such as power, temperature delta, slew rate, size, and robustness. The purpose of this document is to provide assistance to design engineers on key design parameters and considerations when including an integrated thermoelectric cooler into the assembly.

Citation Download Citation

John M. Zamboni "Integrated thermoelectric cooler/package for infrared detector array temperature stabilization", Proc. SPIE 5209, Materials for Infrared Detectors III, (8 December 2003); https://doi.org/10.1117/12.509779

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