Novel low temperature CMOS compatible full wafer bonding process for the fabrication of 3D embedded microchannels using SU-8

Francisco J. Blanco; Maria Agirregabiria; Maria Tijero; Javier Berganzo; Jorge Garcia; Maria Arroyo; Jesus M. Ruano; Inigo Aramburu; Kepa Mayora

doi:10.1117/12.522287

2 April 2004 Novel low-temperature CMOS-compatible full-wafer-bonding process for the fabrication of 3D embedded microchannels using SU-8

Francisco J. Blanco, Maria Agirregabiria, Maria Tijero, Javier Berganzo, Jorge Garcia, Maria Arroyo, Jesus M. Ruano, Inigo Aramburu, Kepa Mayora

Author Affiliations +

Proceedings Volume 5276, Device and Process Technologies for MEMS, Microelectronics, and Photonics III; (2004) https://doi.org/10.1117/12.522287
Event: Microelectronics, MEMS, and Nanotechnology, 2003, Perth, Australia

Abstract

This article describes a novel low temperature full wafer adhesive bonding process to fabricate three-dimensional (3-D) embedded microchannels using SU-8 photoresist as structural material. The technology development includes an improvement of the SU-8 photolithography process in order to produce high uniformity films using Taguchi methodology. After that, 3-D embedded microchannels are fabricated by a low temperature adhesive bonding of the the SU-8 thick-films. The process parameters have been chosen in order to achieve a strong and void-free bond. Different examples using this new technology are shown, including bonding between Silicon, Pyrex and combinations of them, in order to obtain 3-D interconnected microchannels between the wafers. Microchannels with vertical smooth walls and aspect ratios up to five have been obtained. Channels depth from 40 to 60 μm and 10 to 250 μm width have been achieved. Liquid has been introduced into the channels verifying a good sealing of the 3-D microchannels. The fabrication procedure described in this article is fast, reproducible, CMOS compatible and easily implemented using standard photolithography and bonding equipment.

Citation Download Citation

Francisco J. Blanco, Maria Agirregabiria, Maria Tijero, Javier Berganzo, Jorge Garcia, Maria Arroyo, Jesus M. Ruano, Inigo Aramburu, and Kepa Mayora "Novel low-temperature CMOS-compatible full-wafer-bonding process for the fabrication of 3D embedded microchannels using SU-8", Proc. SPIE 5276, Device and Process Technologies for MEMS, Microelectronics, and Photonics III, (2 April 2004); https://doi.org/10.1117/12.522287

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available