Influence of gas on cutting silicon with solid state laser

Udo Klotzbach; Stephanie Maelzer; Thomas Kuntze; Michael Panzner; Michael Doetschel; F. Sonntag; Eckhard Beyer

doi:10.1117/12.532133

15 July 2004 Influence of gas on cutting silicon with solid state laser

Udo Klotzbach, Stephanie Maelzer, Thomas Kuntze, Michael Panzner, Michael Doetschel, F. Sonntag, Eckhard Beyer

Proceedings Volume 5339, Photon Processing in Microelectronics and Photonics III; (2004) https://doi.org/10.1117/12.532133
Event: Lasers and Applications in Science and Engineering, 2004, San Jose, Ca, United States

Abstract

For more than three decades the tool "laser" is used for cutting various materials. Thanks to its high degree of flexibility the laser nowadays becomes a real competitor to existing silicon wafer separating methods in semiconductor industry like grinding with dicing saws. Presently, laser micro maching of silicon wafers is done by solid state lasers with 1064nm or 532nm, processing with 355nm is increasingly investigated [5]. Especially the influence of the gas atmosphere on cutting speed and achievable quality is to be discussed in this paper.

Citation Download Citation

Udo Klotzbach, Stephanie Maelzer, Thomas Kuntze, Michael Panzner, Michael Doetschel, F. Sonntag, and Eckhard Beyer "Influence of gas on cutting silicon with solid state laser", Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); https://doi.org/10.1117/12.532133

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