Paper
20 May 2004 Manufacturing concerns for advanced CMOS circuit realization EBDW alternative solution for cost and cycle time reductions
Laurent Pain, M. Jurdit, Yves T. LaPlanche, J. Todeschini, Serdar Manakli, G. Bervin, Ramiro Palla, A. Beverina, R. Faure, X. Bossy, H. Leininger, S. Tourniol, M. Broekaart, F. Judong, K. Brosselin, P. Gouraud, Veronique De Jonghe, Daniel Henry, M. Woo, Peter Stolk, B. Tavel, F. Arnaud
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Abstract
The introduction of Electron Beam Direct Write lithography into production represents a challenging alternative to reduce cost and cycle time increase induced by the introduction of new generation nodes. This paper details the development work performed to insert transparently direct write lithography process and alignment strategies into CMOS process flows. Finally, this interchangeability between E-Beam and optical lithography steps offers a complete flexibility for device architecture validation and allowed the development of a complete low cost 65nm platform including low-power and general-purpose applications.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Laurent Pain, M. Jurdit, Yves T. LaPlanche, J. Todeschini, Serdar Manakli, G. Bervin, Ramiro Palla, A. Beverina, R. Faure, X. Bossy, H. Leininger, S. Tourniol, M. Broekaart, F. Judong, K. Brosselin, P. Gouraud, Veronique De Jonghe, Daniel Henry, M. Woo, Peter Stolk, B. Tavel, and F. Arnaud "Manufacturing concerns for advanced CMOS circuit realization EBDW alternative solution for cost and cycle time reductions", Proc. SPIE 5374, Emerging Lithographic Technologies VIII, (20 May 2004); https://doi.org/10.1117/12.537188
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Cited by 5 scholarly publications.
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KEYWORDS
Electron beam direct write lithography

Manufacturing

Semiconducting wafers

Lithography

Optical alignment

Control systems

Electron beam lithography

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