Simulation-based mask quality control in a production environment

Linyong Pang; Jiunn-Hung Chen; Lynn Cai; Don Lee; Brian Chu; Vinsent Huang; Te-Yang Fang

doi:10.1117/12.536081

24 May 2004 Simulation-based mask quality control in a production environment

Linyong Pang, Jiunn-Hung Chen, Lynn Cai, Don Lee, Brian Chu, Vinsent Huang, Te-Yang Fang

Proceedings Volume 5375, Metrology, Inspection, and Process Control for Microlithography XVIII; (2004) https://doi.org/10.1117/12.536081
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

Traditionally, mask defect analysis has been done through a visual inspection review. As the semiconductor industry moves into smaller process generations and the complexity of mask exponentially increases, “Mask” issues have emerged as one of the main production problems due to their rising cost and long turn-around time. Mask-making specifications related to defects found on advanced masks also becomes more difficult to define due to the complex features involved [e.g. OPC (Optical Proximity Correction), SRAF (Sub Resolution Assist Features), etc.]. The Automatic Defect Severity Scoring (ADSS) module of i-Virtual Stepper System from Synopsys offers a fast and highly accurate software solution for defect printability analysis of advanced masks in a real production environment. In this paper, we present our case study of production pilot run in which the ADSS is used to automatically quantify the impact of a given defect on the surrounding features, basically filtering out killer defects and nuisance defects in terms of production viewpoints to reduce operators’ intervention. In addition, an automation workflow is also tested, in which the production issues, such as the communication feasibility of mask quality control between mask house and wafer fab, are also considered.

Citation Download Citation

Linyong Pang, Jiunn-Hung Chen, Lynn Cai, Don Lee, Brian Chu, Vinsent Huang, and Te-Yang Fang "Simulation-based mask quality control in a production environment", Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); https://doi.org/10.1117/12.536081

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