Pulsed-laser induced shock wave in fused silica for thin film interfacial testing

Junlan Wang

doi:10.1117/12.583584

21 February 2005 Pulsed-laser induced shock wave in fused silica for thin film interfacial testing

Junlan Wang

Proceedings Volume 5647, Laser-Induced Damage in Optical Materials: 2004; (2005) https://doi.org/10.1117/12.583584
Event: Boulder Damage Symposium XXXVI, 2004, Boulder, Colorado, United States

Abstract

Pulsed-laser induced shock wave development in fused silica is analyzed using nonlinear wave mechanics and applied to thin-film spallation experiments. Due to the negative nonlinear elasticity of fused silica, a laser-induced Gaussian stress pulse evolves into a shock after travelling a certain distance in a fused silica substrate. Experimental observations confirm theoretical predictions of shock development. A decompression shock forms and greatly enhances interfacial failure of a thin film deposited on the substrate. The effectiveness of this wave mechanism is further demonstrated by the successful application in testing ultra-thin low dielectric film/Si substrate interfaces.

Citation Download Citation

Junlan Wang "Pulsed-laser induced shock wave in fused silica for thin film interfacial testing", Proc. SPIE 5647, Laser-Induced Damage in Optical Materials: 2004, (21 February 2005); https://doi.org/10.1117/12.583584

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