Paper
22 January 2005 UV-LIGA fabrication of microscale two-level mold inserts for MEMS applications
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Abstract
Techniques for fabricating high-aspect-ratio microscale structures (HARMS) are being investigated for wide-ranging applications. Microdevices employing metal-based HARMS are of particular interest for mechanical, electro-mechanical, and chemical applications. In many applications, HARMS with two or several distinct heights are necessary, the fabrication of which necessitates two-level or multi-level mold inserts. In addition, tapered mold inserts would help achieving easy insert-part separation. Here we report a process for fabricating two-level, tapered mold inserts by combining UV-lithography on SU-8 resist, one-step metal electrodeposition, polish and level, and SU-8 resist removal. Without tilt and rotation during the lithography process, tapered SU-8 plating molds are obtained by employing light diffraction during lithography and proper development procedures. The SU-8 resist removal process does not reduce its strength. Efficacy of this approach is demonstrated with a two-level insert prototype suitable for fabricating micro heat exchanger parts by compression micromolding.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ren Yang, Jing Jiang, Wanjun Wang, and Wen Jin Meng "UV-LIGA fabrication of microscale two-level mold inserts for MEMS applications", Proc. SPIE 5717, MEMS/MOEMS Components and Their Applications II, (22 January 2005); https://doi.org/10.1117/12.592640
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KEYWORDS
Plating

Nickel

Lithography

Electroplating

Photomasks

Polishing

Diffraction

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