Paper
16 May 2005 Determination of compressive residual stress in a doubly clamped microbeam according to its buckled shape
Cheng Luo, Anand Francis, Xinchuan Liu
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Abstract
In this work, an analytical relationship is derived for a doubly-clamped microbeam when it buckles after release from the substrate. In terms of the relationship, compressive residual stress in the doubly-clamped microbeam can be determined according to its buckled shape, allowing one to find the compressive residual stress directly without much experimental effort. This relationship has been used to determine compressive residual stresses in four types of doubly-clamped SiO2 microbeams. In addition, four methods have been applied to find the elongations of these SiO2 microbeams, and the corresponding results are compared. Finally, the residual stresses in doubly-clamped SiO2 microbeams predicted according to the derived relationship are compared with those found in SiO2 microcantilevers, and the results have a good match.
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Cheng Luo, Anand Francis, and Xinchuan Liu "Determination of compressive residual stress in a doubly clamped microbeam according to its buckled shape", Proc. SPIE 5763, Smart Structures and Materials 2005: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, (16 May 2005); https://doi.org/10.1117/12.600332
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KEYWORDS
Deep reactive ion etching

Etching

Semiconducting wafers

Silicon

Surface roughness

Logic devices

Microelectromechanical systems

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