Paper
12 April 2005 Experimental investigation of vibration behaviors of bonded structures
Joing-Shiun Hsu, Wei-Chung Wang
Author Affiliations +
Proceedings Volume 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; (2005) https://doi.org/10.1117/12.621519
Event: Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, 2004, -, Singapore
Abstract
In this paper, the vibration behaviors of bonded structures were experimentally investigated by incorporating amplitude fluctuation electronic speckle pattern interferometry (AF-ESPI) and modal testing technique. A special casting procedure was employed to manufacture the naturally bonded structures to avoid the influence resulted from the adhesive. Vibration characteristics of bonded structures with different geometrical combinations of constituent adherends and the influence of presence of an interfacial crack were clarified from the distinguished vibration behaviors.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joing-Shiun Hsu and Wei-Chung Wang "Experimental investigation of vibration behaviors of bonded structures", Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); https://doi.org/10.1117/12.621519
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KEYWORDS
Polymethylmethacrylate

Adhesives

Interferometry

Manufacturing

Speckle pattern

Safety

Experimental mechanics

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