Paper
23 January 2006 Optical characterization of 9x9 optical cross connect utilizing silicon lens scanners with spider-leg actuators
Ho Nam Kwon, Jong-Hyun Lee, Kazuhiro Takahashi, Hiroshi Toshiyoshi
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Abstract
This paper presents a 9×9 OXC (Optical Cross Connect) utilizing two-dimensional micro-lens scanners, each of which consists of eight 'L' shaped (spider-leg) stage-suspension springs and rotational comb-drive actuators. Silicon was used as a lens material because of the mechanical stability and optical transparency to infrared wavelength of 1.55 μm. The micro lens scanner was fabricated by lens-profile-transferring to the structural layer of an SOI wafer by the RIE (reactive ion etching) from thermally reflowed photoresist. The XY stage moved more than 55 μm independently in the X and Y directions with applied voltage of 65 V. In optical measurement, the coupling loss was 13 dB, and channel uniformity of 9×9 OXC was less than 4.5 dB.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ho Nam Kwon, Jong-Hyun Lee, Kazuhiro Takahashi, and Hiroshi Toshiyoshi "Optical characterization of 9x9 optical cross connect utilizing silicon lens scanners with spider-leg actuators", Proc. SPIE 6114, MOEMS Display, Imaging, and Miniaturized Microsystems IV, 61140E (23 January 2006); https://doi.org/10.1117/12.645631
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CITATIONS
Cited by 5 scholarly publications.
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KEYWORDS
Actuators

Scanners

Optical fibers

Silicon

Reactive ion etching

Semiconducting wafers

Polarization

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