High-throughput contact critical dimension and gray level value measurement

Hong Xiao; Wei Fang; Yan Zhao; Mark Huang; Kai Wang; Darren Wong; Jack Jau

doi:10.1117/12.656978

24 March 2006 High-throughput contact critical dimension and gray level value measurement

Hong Xiao, Wei Fang, Yan Zhao, Mark Huang, Kai Wang, Darren Wong, Jack Jau

Proceedings Volume 6152, Metrology, Inspection, and Process Control for Microlithography XX; 61523L (2006) https://doi.org/10.1117/12.656978
Event: SPIE 31st International Symposium on Advanced Lithography, 2006, San Jose, California, United States

Abstract

A high-throughput e-beam monitoring system, eProfile®, is designed to quickly measure gray level value (GLV) and critical dimension (CD) of the structures of interest on product wafers. Two wafers are used in this study, one wafer is at after etch inspection (AEI) with contact mask focus exposure matrix (FEM), and another is normal exposure contact AEI wafer. High-throughput CD measurement of AEI wafer at holes with different patterns, such as semi-dense and SRAM array were measured with results matched the FEM expectation very well. The system is also be used to measure GLV of the SEM images on contact holes of a normal production wafer to reflected the under etch (high GLV) problem in a semi-dense hole pattern.

Citation Download Citation

Hong Xiao, Wei Fang, Yan Zhao, Mark Huang, Kai Wang, Darren Wong, and Jack Jau "High-throughput contact critical dimension and gray level value measurement", Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61523L (24 March 2006); https://doi.org/10.1117/12.656978

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