Hybrid health monitoring of structural joints using modal parameters and EMI signatures

Jeong-Tae Kim; Won-Bae Na; Jae-Hyung Park; Dong-Soo Hong

doi:10.1117/12.661596

11 April 2006 Hybrid health monitoring of structural joints using modal parameters and EMI signatures

Jeong-Tae Kim, Won-Bae Na, Jae-Hyung Park, Dong-Soo Hong

Proceedings Volume 6174, Smart Structures and Materials 2006: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems; 61742O (2006) https://doi.org/10.1117/12.661596
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2006, San Diego, California, United States

Abstract

To develop a promising hybrid structural health monitoring system, which enables to detect damage by the dynamic response of the entire structure and more accurately locate damage with denser sensor array, a combined use of mechanical vibration and electro-mechanical impedance is proposed. For the verification of the proposed healthmonitoring scheme, a series of damage scenarios are designed to simulate various situations at which the connection joints can experience during their service life. The obtained experimental results, modal parameters and electro-magnetic impedance signatures, are carefully analyzed to recognize the connecting states and the target damage locations. From the analysis, it is shown that the proposed hybrid health monitoring system is successful for acquiring global and local damage information on the structural joints; hence, its effectiveness is verified.

Citation Download Citation

Jeong-Tae Kim, Won-Bae Na, Jae-Hyung Park, and Dong-Soo Hong "Hybrid health monitoring of structural joints using modal parameters and EMI signatures", Proc. SPIE 6174, Smart Structures and Materials 2006: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, 61742O (11 April 2006); https://doi.org/10.1117/12.661596

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