Paper
20 March 2007 Processing benefits of high repetition rate and high average power 355 nm laser for micromachining of microelectronics packaging materials
Author Affiliations +
Abstract
It has been shown that micromachining of polyimide using a mode-locked high repetition rate, 80 MHz, 355nm laser is more efficient than the q-switched laser at same wavelength and same power level in terms of material removal rate. In this study we have explored and characterized the benefits of using high repetition rate, high average power, 355 nm mode-locked and q-switched lasers for micromachining of various microelectronics packaging materials that have different thermal properties. The removal rate and quality of machining have been analyzed against the difference in thermal properties of the material. The implications of the results observed are also discussed from practical manufacturing perspective.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rajesh S. Patel and James Bovatsek "Processing benefits of high repetition rate and high average power 355 nm laser for micromachining of microelectronics packaging materials", Proc. SPIE 6459, Laser-based Micro- and Nanopackaging and Assembly, 64590H (20 March 2007); https://doi.org/10.1117/12.705589
Lens.org Logo
CITATIONS
Cited by 6 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Mode locking

Q switched lasers

Laser cutting

Laser processing

Semiconductor lasers

Silicon

Copper

Back to Top