PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
This paper highlights a systematic investigation (related to percentage addition of solvents) of finding the
appropriate solvent to reduce the viscosity of the structural grade of resin (AV138M) within castable range
to effectively disperse the nano-fillers (Carbon Nano Powder - CNP and Multi Walled Carbon Nano Tubes
- MWCNT). AV138M + HY998/CNP and AV138 + HY998/MWCNT were cast within-process degassing
using a vacuum pump of capacity 4 torr. High energy sonic waves (27000 kHz) were used for dispersion.
Morphological studies were undertaken to analyze the uniformity in dispersion of nano-fillers. The cured
specimens were subjected to: Resistivity measurements using a Resistivity Meter, Glass Transition
Temperature (Tg) using a Differential Scanning Calorimetry (DSC) and Tensile properties using UTM. The
properties have been determined for the nanocomposites with different wt % of the fillers. It has been
found that for 0.6 wt % of filler (CNP / MWCNT), there is an increase in UTS of 10 times for MWCNT
compared to CNP; for 1.0 wt % of the fillers, the Tg improved by 10 ºC for MWCNT and by 4 ºC for CNP
when compared with neat resin. Both CNP and MWCNT showed drop in electrical resistivity of the neat
resin; a drop to the extent of 103 has been achieved with 1 wt % MWCNT and the same was 2 wt % in
case of CNP.
Anil Chinnabhandar,H. N. Narasimha Murthy, andM. Krishna
"Effect of dispersing nano-materials into structural adhesive on the electrical and mechanical properties", Proc. SPIE 6799, BioMEMS and Nanotechnology III, 67991H (27 December 2007); https://doi.org/10.1117/12.784812
ACCESS THE FULL ARTICLE
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
The alert did not successfully save. Please try again later.
Anil Chinnabhandar, H. N. Narasimha Murthy, M. Krishna, "Effect of dispersing nano-materials into structural adhesive on the electrical and mechanical properties," Proc. SPIE 6799, BioMEMS and Nanotechnology III, 67991H (27 December 2007); https://doi.org/10.1117/12.784812