Integration of polymer self-assembly for lithographic application

Joy Y. Cheng; Daniel P. Sanders; Ho-Cheol Kim; Linda K. Sundberg

doi:10.1117/12.773247

21 March 2008 Integration of polymer self-assembly for lithographic application

Joy Y. Cheng, Daniel P. Sanders, Ho-Cheol Kim, Linda K. Sundberg

Proceedings Volume 6921, Emerging Lithographic Technologies XII; 692127 (2008) https://doi.org/10.1117/12.773247
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

Directed polymer self-assembly which combines lithographically defined substrates and self-assembled polymers has been considered as a potential candidate to extend conventional patterning techniques. In the past few years, successful demonstration of directed self-assembly of block copolymer shows that this method can afford sub-lithographic resolution or enhances dimensional control. However, integration of polymer self-assembly into standard lithographic processes remains a challenge and requires new materials. In this paper, we demonstrate robust and thermally crosslinked underlayer materials which control the orientation of block copolymer assemblies and are compatible with standard lithographic processes. These new materials allow simple integration of perpendicularly oriented polystyrene-b- polymethylmethacrylate (PS-b-PMMA) domains into standard manufacturing processes.

Citation Download Citation

Joy Y. Cheng, Daniel P. Sanders, Ho-Cheol Kim, and Linda K. Sundberg "Integration of polymer self-assembly for lithographic application", Proc. SPIE 6921, Emerging Lithographic Technologies XII, 692127 (21 March 2008); https://doi.org/10.1117/12.773247

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