Paper
17 March 2008 Thermal stress analysis of a circular holed specimen
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Abstract
Structural components subjected to high frequency vibrations, such as those used in vibrating parts of gas turbine engines, are usually required to avoid resonance frequencies. Although the operating frequency is designed at more than resonance frequencies, the structure, when a vibrating structure starts or stops, has to pass through a resonance frequency, which results in large stress concentration. This paper applies thermography to analyze transient stress variation of a circular holed plate. In experiment, the finite element modal (FEM) analysis of the specimen was performed and the surface temperature measured by infrared camera is calculated to the stress of the nearby hole, based on thermoelastic equation. Stress distributions between 2nd and 3rd vibration mode are investigated with thermography and also dynamic stress concentration factors according to the change of vibration amplitude are estimated at resonance frequency.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
W. T. Kim, M. Y. Choi, J. H. Park, and K. S. Kang "Thermal stress analysis of a circular holed specimen", Proc. SPIE 6939, Thermosense XXX, 69391G (17 March 2008); https://doi.org/10.1117/12.777986
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CITATIONS
Cited by 1 scholarly publication.
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KEYWORDS
Finite element methods

Thermography

Infrared cameras

Temperature metrology

Manufacturing

Stress analysis

Infrared detectors

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