Paper
11 April 2008 Thermal simulations of packaged IR LED arrays
John V. Lawler, Joseph Currano
Author Affiliations +
Abstract
The steady-state and transient behaviors of packaged IR LED arrays have been studied via numerical simulations. The waste heat generated by LEDs must be removed through a cold plate or a cryogenic cold finger attached to the backside of the driver array. Therefore, this heat must travel across the LED array-driver interface and through the driver array. The modeling results demonstrate that the thermal resistance of these components can be significant. The steady-state temperature profiles across several configurations are used to identify the thermal bottlenecks. Transient simulations are used to quantify the rise and fall times of the IR LEDs, and the fall times can be significantly reduced by changes in the LED layout. These proposed guidelines to minimize thermal issues in LED arrays should result in better performing and more reliable IR LED arrays.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John V. Lawler and Joseph Currano "Thermal simulations of packaged IR LED arrays", Proc. SPIE 6942, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XIII, 69420E (11 April 2008); https://doi.org/10.1117/12.778719
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CITATIONS
Cited by 1 scholarly publication and 1 patent.
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KEYWORDS
Light emitting diodes

Thermography

Sensors

Infrared radiation

Metals

Thermal modeling

Black bodies

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