Thermal simulations of packaged IR LED arrays

John V. Lawler; Joseph Currano

doi:10.1117/12.778719

11 April 2008 Thermal simulations of packaged IR LED arrays

John V. Lawler, Joseph Currano

Proceedings Volume 6942, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XIII; 69420E (2008) https://doi.org/10.1117/12.778719
Event: SPIE Defense and Security Symposium, 2008, Orlando, Florida, United States

Abstract

The steady-state and transient behaviors of packaged IR LED arrays have been studied via numerical simulations. The waste heat generated by LEDs must be removed through a cold plate or a cryogenic cold finger attached to the backside of the driver array. Therefore, this heat must travel across the LED array-driver interface and through the driver array. The modeling results demonstrate that the thermal resistance of these components can be significant. The steady-state temperature profiles across several configurations are used to identify the thermal bottlenecks. Transient simulations are used to quantify the rise and fall times of the IR LEDs, and the fall times can be significantly reduced by changes in the LED layout. These proposed guidelines to minimize thermal issues in LED arrays should result in better performing and more reliable IR LED arrays.

Citation Download Citation

John V. Lawler and Joseph Currano "Thermal simulations of packaged IR LED arrays", Proc. SPIE 6942, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XIII, 69420E (11 April 2008); https://doi.org/10.1117/12.778719

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