A Packaging Technique To Achieve Stable Single-Mode Fiber To Laser Alignment

Scott Enochs

doi:10.1117/12.965188

17 February 1987 A Packaging Technique To Achieve Stable Single-Mode Fiber To Laser Alignment

Scott Enochs

Proceedings Volume 0703, Integration and Packaging of Optoelectronic Devices; (1987) https://doi.org/10.1117/12.965188
Event: Cambridge Symposium-Fiber/LASE '86, 1986, Cambridge, MA, United States

Abstract

A packaging technique that enables a low-loss optical couple between a single-mode laser diode and a single-mode optical fiber has been developed. The technique uses a miniature thin-film substrate with an onboard resistor to mount and subsequently align a lensed and metallized fiber to an emitting laser diode. The resistor serves as a local heat source to first effect the attachment of the fiber to the substrate and second to effect the attachment of the fiber-substrate assembly into aligned position with the laser. Thermal stability of optical couples made with this technique is demonstrated.

Citation Download Citation

Scott Enochs "A Packaging Technique To Achieve Stable Single-Mode Fiber To Laser Alignment", Proc. SPIE 0703, Integration and Packaging of Optoelectronic Devices, (17 February 1987); https://doi.org/10.1117/12.965188

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