Development of a Mach-Zehnder interferometer based on a twin-core fiber and analysis of its thermal stability

Luis Fernández; Pedro Torres; Jesús Causado; Rafael Betancur

doi:10.1117/12.794916

25 August 2008 Development of a Mach-Zehnder interferometer based on a twin-core fiber and analysis of its thermal stability

Luis Fernández, Pedro Torres, Jesús Causado, Rafael Betancur

Author Affiliations +

Proceedings Volume 7056, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications II; 705613 (2008) https://doi.org/10.1117/12.794916
Event: Photonic Devices + Applications, 2008, San Diego, California, United States

Abstract

This work presents a research in which a Twin Core Fiber (TCF) has been employed for designing a Mach- Zehnder interferometer and its behavior under the effect of thermal gradients has been regarded. From the coupled modes theory can be deduced that under the phase-matched condition-that is similar propagation constants in both cores of a TCF, the energy transported in the cores is the same, which is fundamental for developing this interferometer. This research required to design a thermal cavity and an automation circuit for applying thermal cycles to a segment of the TCF. The temperature was recorded by means of a thermocouple placed inside the thermal cavity and its signal was introduced into the computer where an instrumentation software (Lab View) designed for monitoring and controlling variables used this signal for controlling the on-off states of a power resistor and a refrigeration system for raising and lowering the temperature, respectively. It was observed that the optical power variations in a point of the interference pattern presented a weak dependence with the thermal cycles.

Citation Download Citation

Luis Fernández, Pedro Torres, Jesús Causado, and Rafael Betancur "Development of a Mach-Zehnder interferometer based on a twin-core fiber and analysis of its thermal stability", Proc. SPIE 7056, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications II, 705613 (25 August 2008); https://doi.org/10.1117/12.794916

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available