Study on fabrication of silicon microcantilevers for the pulse sensor by a laser etching technology

Lu Wang; Dian-zhong Wen

doi:10.1117/12.834551

24 August 2009 Study on fabrication of silicon microcantilevers for the pulse sensor by a laser etching technology

Lu Wang, Dian-zhong Wen

Proceedings Volume 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors; 73811S (2009) https://doi.org/10.1117/12.834551
Event: International Symposium on Photoelectronic Detection and Imaging 2009, 2009, Beijing, China

Abstract

To solve some problems of silicon micro-cantilevers etching rate and quality, a new method which combines laser micromachining processes and micro-electromechanical systems (MEMS) is adopted to fabricate silicon microcantilevers. The experimental results show that the laser etching technology provides an excellent alternative approach to release silicon micro-cantilever beams from silicon substrate with low cost, high etching rate, precision of operation, and design flexibility, which avoiding convex corner undercutting in etching of micro-cantilevers. This study also provides a new method of laser etching technology for the fabrication of other microstructures.

Citation Download Citation

Lu Wang and Dian-zhong Wen "Study on fabrication of silicon microcantilevers for the pulse sensor by a laser etching technology", Proc. SPIE 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors, 73811S (24 August 2009); https://doi.org/10.1117/12.834551

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