Parameters of hot embossing in microfluidic chips

Wei Wang; Shaofeng Li; Li Tian; Jianmin Li; Tian Qin; Xiaowei Liu

doi:10.1117/12.885666

31 December 2010 Parameters of hot embossing in microfluidic chips

Wei Wang, Shaofeng Li, Li Tian, Jianmin Li, Tian Qin, Xiaowei Liu

Proceedings Volume 7544, Sixth International Symposium on Precision Engineering Measurements and Instrumentation; 75446B (2010) https://doi.org/10.1117/12.885666
Event: Sixth International Symposium on Precision Engineering Measurements and Instrumentation, 2010, Hangzhou, China

Abstract

Twice hot-embossing, a new technology of hot-embossing proposed, can effectively reduce the error of hot forming caused by hot equipment. The depth / width ratio of micro-channel on the metal concave-mother-template is an influence parameter of twice hot-embossing; Optimization of the parameters, the PMMA convex-template has been produced in 120°C, ± 6MPa by twice hot-embossing.

Citation Download Citation

Wei Wang, Shaofeng Li, Li Tian, Jianmin Li, Tian Qin, and Xiaowei Liu "Parameters of hot embossing in microfluidic chips", Proc. SPIE 7544, Sixth International Symposium on Precision Engineering Measurements and Instrumentation, 75446B (31 December 2010); https://doi.org/10.1117/12.885666

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