Converging technologies and demands toward high-bandwidth optical interconnects

Tolga Tekin

doi:10.1117/12.843043

16 February 2010 Converging technologies and demands toward high-bandwidth optical interconnects

Tolga Tekin

Proceedings Volume 7607, Optoelectronic Interconnects and Component Integration IX; 76070E (2010) https://doi.org/10.1117/12.843043
Event: SPIE OPTO, 2010, San Francisco, California, United States

Abstract

In last decades various approaches have been investigated within frame of photonics research activities. From hybrid assembly to monolithically integration including III-V and CMOS technologies, the main challenges remained: cost effective, high bandwidth, high-density devices, components and subsystems. This paper will review basic photonics packaging approaches/concepts which have been developed over years in different research projects and platforms. Furthermore, targeting the converging technologies the demands on future heterogeneous integration perspective will be discussed with respect to high bandwidth interconnects.

Citation Download Citation

Tolga Tekin "Converging technologies and demands toward high-bandwidth optical interconnects", Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 76070E (16 February 2010); https://doi.org/10.1117/12.843043

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available