Optical interface devices applying UV curable resin for flexible optical interconnection

Osamu Mikami; Masahiro Kanda

doi:10.1117/12.840129

23 February 2010 Optical interface devices applying UV curable resin for flexible optical interconnection

Osamu Mikami, Masahiro Kanda

Proceedings Volume 7607, Optoelectronic Interconnects and Component Integration IX; 76070T (2010) https://doi.org/10.1117/12.840129
Event: SPIE OPTO, 2010, San Francisco, California, United States

Abstract

The success of optical interconnection for practical use is strongly dependent on the development of a sophisticated packaging and coupling technology capable of both high coupling efficiency and easy alignment. We have developed the photomask transfer method applying UV curable resin. This technology enables fabrication of arrayed M x N optical patterns at one shot of UV light. It is also possible to fabricate very precise patterns by a conventional photomask. The length/thickness of the fabricated patterns can be controlled by the thickness between the photomask and the substrate. The maximum length reaches over 1,000μm. As applications using this method, two original devices are reviewed. One is a chip optical device which consists of a VCSEL (vertical cavity surface emitting laser), optical rods as cores, and a surrounding clad layer. These optical rods can be accurately fabricated on the emitting spot of the VCSEL. This VCSEL device enables flexible packaging on OE-PWBs (opto-electric printed wiring boards). Another is a 90-degree light path conversion device for coupling to an optical wiring on OE-PWBs. It features in hybrid comb-clad consisting of air and polymer parts. This device has a large refractive index difference between the core and hybrid comb-clad, and enables downsizing.

Citation Download Citation

Osamu Mikami and Masahiro Kanda "Optical interface devices applying UV curable resin for flexible optical interconnection", Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 76070T (23 February 2010); https://doi.org/10.1117/12.840129

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available