Paper
22 March 2010 Measuring resist-induced contrast loss using EUV interference lithography
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Abstract
In this paper the contrast behavior of photoresists upon EUV exposure is addressed. During a lithographic exposure, the intended shape undergoes contrast loss which can be divided into two portions. One part is assigned to exposure tool induced contrast loss (e.g. aberrations of the exposure optics, mechanical stability of the system), while the other part is due to chemical processes in the resist during exposure and development. Both contributors have to be decoupled from each other in order to solely analyze the resist contrast loss. The method presented here is based on an experimental evaluation of dense line/space patterns obtained from EUV exposures. For decoupling of the resist induced contrast loss from the exposure tool contrast, the aerial image has to be determined. As an alternative EUV exposure tool the EUV interference lithography (EUV-IL) beamline at Paul Scherrer Institute is applied for resist qualification. The theoretical description of the sinusoidal aerial image of the EUV-IL tool is presented as well as the experimental method applied to analyze resist patterns in terms of resist contrast. Finally, the results are compared with data obtained from ASML's ADT EUV scanner.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andreas Langner, Harun H. Solak, Roel Gronheid, Eelco van Setten, Vaida Auzelyte, Yasin Ekinci, Koen van Ingen Schenau, and Kees Feenstra "Measuring resist-induced contrast loss using EUV interference lithography", Proc. SPIE 7636, Extreme Ultraviolet (EUV) Lithography, 76362X (22 March 2010); https://doi.org/10.1117/12.846495
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Cited by 8 scholarly publications.
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KEYWORDS
Nanoimprint lithography

Extreme ultraviolet lithography

Modulation transfer functions

Photomasks

Lithography

Silicon

Electroluminescence

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