Paper
22 October 2010 Design, manufacture and properties of high-definition diffractive objective lens
Ming-yue Wei, Meng Wang, Bin Li
Author Affiliations +
Abstract
Microlens has a wide application in the micro-optical systems. In this paper, wet etching process is adopted to fabricate high-definition (HD) diffractive objective lens. During the design process, Rayleigh-Sommerfeld integral transformation is used to optimize the traditional G-S algorithm, so that the simulation algorithm is more precise and the diffraction efficiency of objective lens is improved remarkably . In the manufacture process, which is based on the anisotropic etching characteristic of silicon materials, the fabrication method introduced in this paper is different with other traditional fabrication approaches of micro-optical device, in which the accurate and complex multi-step photolithography is not needed, instead, a single-step photolithography and a dual-step wet etching process is adopted. In the first step of the wet etching, an inverted pyramid structure was formed on the surface of silicon wafer, depending on the difference of corrosion features between Si-100 plane and Si-111 plane, and the principle of automatic stop. In the second step, surface relief stair-structure with different height is obtained by keeping corroding according to the erotion features between Si-111 plane and Si-114 plane. The surface morphology and optical tests of the lens indicate that the full outline of its stair-structure is clear, the surface roughness in the range of tens of nanometer, which meets the requirements of optical mirror.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ming-yue Wei, Meng Wang, and Bin Li "Design, manufacture and properties of high-definition diffractive objective lens", Proc. SPIE 7657, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 76570E (22 October 2010); https://doi.org/10.1117/12.867713
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KEYWORDS
Silicon

Corrosion

Diffraction

Wet etching

Etching

Objectives

Anisotropic etching

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