Photomechanical imager FPA design for manufacturability

M. Erdtmann; G. Simelgor; S. Radhakrishnan; L. Zhang; Y. Liu; P. Y. Emelie; J. Salerno

doi:10.1117/12.850286

3 May 2010 Photomechanical imager FPA design for manufacturability

M. Erdtmann, G. Simelgor, S. Radhakrishnan, L. Zhang, Y. Liu, P. Y. Emelie, J. Salerno

Proceedings Volume 7660, Infrared Technology and Applications XXXVI; 766017 (2010) https://doi.org/10.1117/12.850286
Event: SPIE Defense, Security, and Sensing, 2010, Orlando, Florida, United States

Abstract

Employing an optical readout architecture expands the capabilities offered by uncooled thermal imagers, such as extremely fast frame rates, dual-band imaging, and multi-megapixel resolution. It also affords the ability to incorporate multiple pixel designs on the same infrared sensor chip, which we have taken advantage of to fabricate an optical readout photomechanical imager with 12 distinct pixel designs in the sensor chip layout. Using this methodology, we were able to quickly sort the designs in terms of performance and suitability for manufacturing, and thus, in an expedient and highly cost-effective manner, determine which pixel designs have merited future consideration for full-scale prototyping. A fast frame rate MWIR photomechanical imager based on one of the best pixel designs was built and tested for high-speed imaging of small arms fire.

Citation Download Citation

M. Erdtmann, G. Simelgor, S. Radhakrishnan, L. Zhang, Y. Liu, P. Y. Emelie, and J. Salerno "Photomechanical imager FPA design for manufacturability", Proc. SPIE 7660, Infrared Technology and Applications XXXVI, 766017 (3 May 2010); https://doi.org/10.1117/12.850286

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