Paper
1 January 1987 Generation Of Design Rules Consistent With Lithographic Capability
Christopher P. Ausschnitt, Shaunee Cheng, Michael Lutz
Author Affiliations +
Abstract
Integrated circuit (IC) design rules are determined by: 1. Circuit performance required to meet the needs of the IC customer, 2. Production capability of the IC manufacturer. In the first case, the only constraint is device physics. In the second case, the constraints are equipment and process performance coupled with the intrinsic variability of the manufacturing cycle. We view the generation of design rules from the manufacturing perspective. In examples, we relate design rules to lithographic performance as measured in a one-micron production environment. The effects of spatial and temporal variation on critical dimension and pattern registration control are treated. We establish a method to identify the cost/benefit tradeoffs of design and manufacturing. The resultant design rules embody guidelines for the cost-effective manufacture of competitive IC products.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christopher P. Ausschnitt, Shaunee Cheng, and Michael Lutz "Generation Of Design Rules Consistent With Lithographic Capability", Proc. SPIE 0772, Optical Microlithography VI, (1 January 1987); https://doi.org/10.1117/12.967038
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KEYWORDS
Manufacturing

Semiconducting wafers

Lithography

Critical dimension metrology

Optical alignment

Control systems

Tolerancing

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