Beam shaping: top hat and customized intensity distributions for semiconductor manufacturing and inspection

Ansgar Teipel; Lutz Aschke

doi:10.1117/12.879640

22 March 2011 Beam shaping: top hat and customized intensity distributions for semiconductor manufacturing and inspection

Ansgar Teipel, Lutz Aschke

Author Affiliations +

Proceedings Volume 7973, Optical Microlithography XXIV; 797321 (2011) https://doi.org/10.1117/12.879640
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

Enabling the next technology nodes with optical technologies means further reduced error budgets for optical systems and new optical approaches for higher precision and increased throughput. This contribution discusses important aspects and features of laser beam shaping in optical systems for semiconductor manufacturing and inspection. Beam shaping principles for different types of lasers and illumination requirements are explained.

Citation Download Citation

Ansgar Teipel and Lutz Aschke "Beam shaping: top hat and customized intensity distributions for semiconductor manufacturing and inspection", Proc. SPIE 7973, Optical Microlithography XXIV, 797321 (22 March 2011); https://doi.org/10.1117/12.879640

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