Laser Machining Of Ceramic And Silicon

Christoph Hamann; Hans-Georg Rosen

doi:10.1117/12.941232

22 September 1987 Laser Machining Of Ceramic And Silicon

Christoph Hamann, Hans-Georg Rosen

Proceedings Volume 0801, High Power Lasers: Sources, Laser-Material Interactions, High Excitations, and Fast Dynamics; (1987) https://doi.org/10.1117/12.941232
Event: Fourth International Symposium on Optical and Optoelectronic Applied Sciences and Engineering, 1987, The Hague, Netherlands

Abstract

Ceramics and silicon are brittle materials, a fact that may cause problems and at the same time be helpful while machining with lasers. After giving a short introduction to ceramics different ways of cutting and drilling alumina (Al203) and silicon (Si) are discussed and compared to conventional methods. Examples from electronics industry with regard to types of laser, quality and velocity of process are presented.

Citation Download Citation

Christoph Hamann and Hans-Georg Rosen "Laser Machining Of Ceramic And Silicon", Proc. SPIE 0801, High Power Lasers: Sources, Laser-Material Interactions, High Excitations, and Fast Dynamics, (22 September 1987); https://doi.org/10.1117/12.941232

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