Simultaneous out-of-plane and in-plane displacements measurement by using digital holography around a hole or indentation

Matias R. Viotti; Christian Kohler; Armando Albertazzi Jr.

doi:10.1117/12.889318

26 May 2011 Simultaneous out-of-plane and in-plane displacements measurement by using digital holography around a hole or indentation

Matias R. Viotti, Christian Kohler, Armando Albertazzi Jr.

Author Affiliations +

Proceedings Volume 8082, Optical Measurement Systems for Industrial Inspection VII; 80820E (2011) https://doi.org/10.1117/12.889318
Event: SPIE Optical Metrology, 2011, Munich, Germany

Abstract

A measurement prototype based on digital holography for the simultaneous measurement of out-of-plane and radial in-plane displacement fields is shown. This prototype enables recording two holograms at the same time with a single image taken by a digital camera and evaluating separately in-plane and out-of-plane displacement components. An axicon-type diffractive optical element (DOE) is used for the illumination of the object, which causes radial sensitivity vectors. Blind holes as well as spherical indentations were preformed over a welded steel plate (containing residual stresses). By using the digital holography setup, typical out-of-plane and in-plane displacement fields, generated when the hole was introduced into the stresses material, were measured and compared with theoretical ones. Good agreement was found between them. In addition, a mature digital speckle pattern interferometry (DSPI) setup was used to measure only the in-plane component around the hole. Good agreement between both systems was also found. Finally, displacements fields were measured around indentation marks. In this case, preliminary results show that out-of-plane displacements are larger than in-plane ones, enabling its use for residual stress computation or maybe material properties determination.

Citation Download Citation

Matias R. Viotti, Christian Kohler, and Armando Albertazzi Jr. "Simultaneous out-of-plane and in-plane displacements measurement by using digital holography around a hole or indentation", Proc. SPIE 8082, Optical Measurement Systems for Industrial Inspection VII, 80820E (26 May 2011); https://doi.org/10.1117/12.889318

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available