Paper
3 October 2011 Recent developments of multispectral filter assemblies for CCD, CMOS and bolometer
Roland Le Goff, Bruno Badoil, Philippe Fuss, François Tanguy, Pierre Etcheto
Author Affiliations +
Abstract
Multispectral channels are required on many pushbroom optical sensors. A possible technology well suited for focal plane miniaturization is to assemble several sliced filter elements (so-called stripes), each corresponding to one spectral channel, and located close to the detectors. The assembled filter is thus customized to fit detector size. These stripes are cut from a wafer using a two dimensional accurate process. For the baseline concept, elementary stripes are then cemented edge-to-edge to form a single substrate. The opaque epoxy used for the stripes assembly creates a light barrier between adjacent elements and thus provides an interesting solution for cross channel image suppression inside the filter. This paper recalls the current SODERN's multi-spectral filter assembly status. Since 2007 R&T activity, the feasibility and the performances have been demonstrated by breadboards and qualification models. The selection of SODERN for two current VNIR space programs consolidates its role as a leading supplier in this field. A complementary 2011 R&T study will demonstrate the performances of this technology for the TIR range and the integration on a bolometer.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Roland Le Goff, Bruno Badoil, Philippe Fuss, François Tanguy, and Pierre Etcheto "Recent developments of multispectral filter assemblies for CCD, CMOS and bolometer", Proc. SPIE 8176, Sensors, Systems, and Next-Generation Satellites XV, 817618 (3 October 2011); https://doi.org/10.1117/12.898971
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CITATIONS
Cited by 6 scholarly publications.
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KEYWORDS
Optical filters

Sensors

Bolometers

Image filtering

Thin film coatings

Semiconducting wafers

Manufacturing

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