Paper
7 May 2013 Simultaneous optimization of confinement and thermal performance for heteroepitaxial InP on SoI hybrid lasers
C. Pang, H. Benisty, M. Besbes
Author Affiliations +
Abstract
In new designs permitted by heteroepitaxial bonding of III-V active slabs onto nano-patterened SoI wafers, two constraints arise in the design: optical confinement and thermal performance. One require less silicon for the former and more silicon for the latter. We propose a mitigation strategy based on electromagnetism and a flip-flop algorithm.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. Pang, H. Benisty, and M. Besbes "Simultaneous optimization of confinement and thermal performance for heteroepitaxial InP on SoI hybrid lasers", Proc. SPIE 8781, Integrated Optics: Physics and Simulations, 87810D (7 May 2013); https://doi.org/10.1117/12.2017001
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Silicon

Cladding

Semiconducting wafers

Nanostructuring

Waveguides

Etching

Nanostructures

Back to Top