Radiation hardness by design for mixed signal infrared readout circuit applications

Stephen Gaalema; James Gates; David Dobyns; Greg Pauls; Bruce Wall

doi:10.1117/12.2024671

19 September 2013 Radiation hardness by design for mixed signal infrared readout circuit applications

Stephen Gaalema, James Gates, David Dobyns, Greg Pauls, Bruce Wall

Proceedings Volume 8868, Infrared Sensors, Devices, and Applications III; 88680I (2013) https://doi.org/10.1117/12.2024671
Event: SPIE Optical Engineering + Applications, 2013, San Diego, California, United States

Abstract

Readout integrated circuits (ROICs) to support space-based infrared detection applications often have severe radiation tolerance requirements. Radiation hardness-by-design (RHBD) significantly enhances the radiation tolerance of commercially available CMOS and custom radiation hardened fabrication techniques are not required. The combination of application specific design techniques, enclosed gate architecture nFETs and intrinsic thin oxide radiation hardness of 180 nm process node commercial CMOS allows realization of high performance mixed signal circuits. Black Forest Engineering has used RHBD techniques to develop ROICs with integrated A/D conversion that operate over a wide range of temperatures (40K-300K) to support infrared detection. ROIC radiation tolerance capability for 256x256 LWIR area arrays and 1x128 thermopile linear arrays is presented. The use of 130 nm CMOS for future ROIC RHBD applications is discussed.

Citation Download Citation

Stephen Gaalema, James Gates, David Dobyns, Greg Pauls, and Bruce Wall "Radiation hardness by design for mixed signal infrared readout circuit applications", Proc. SPIE 8868, Infrared Sensors, Devices, and Applications III, 88680I (19 September 2013); https://doi.org/10.1117/12.2024671

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