A broadband silicon electro-absorption modulator (EAM) using a Schottky diode

Uiseok Jeong; Dongchul Han; Dong Ho Lee; Kyungwoon Lee; J. Kim; Jung Ho Park

doi:10.1117/12.2038800

8 March 2014 A broadband silicon electro-absorption modulator (EAM) using a Schottky diode

Uiseok Jeong, Dongchul Han, Dong Ho Lee, Kyungwoon Lee, J. Kim, Jung Ho Park

Proceedings Volume 8988, Integrated Optics: Devices, Materials, and Technologies XVIII; 89881M (2014) https://doi.org/10.1117/12.2038800
Event: SPIE OPTO, 2014, San Francisco, California, United States

Abstract

A silicon optical modulator operating at high speed and low voltage is proposed by using a Schottky diode. The optical modulation is achieved by the intensity change of guiding light due to free-carrier absorption, not conventional interference effects. The rib waveguide structure of the modulator has a height of 340 nm, a etch depth of 150 nm, a width of 4.8 μm, and a modulation length of 500 μm. It was designed to maximize the free carrier injection by a Schottky contact on the rib waveguide center. The center of the rib waveguide is lightly doped with phosphorus of 10¹⁶ cm⁻³, and the sides are heavily doped with phosphorus of 10²⁰ cm⁻³ to improve modulation depth by injecting free carriers into the center of the rib waveguide. This design allowed a high overlap between the optical mode and carrier density variations in the center of the waveguide. To achieve high speed operation, travelling-wave type electrodes were designed to allow co-propagation of electrical and optical signals along the waveguide. The device simulated results demonstrate a 3.3 dB modulation depth for a 500 μm modulation length with 3 V_pp driving voltages. We demonstrated a Schottky modulator operating Si EAM at 3 V_pp with a 3 dB bandwidth of 7 GHz.

Citation Download Citation

Uiseok Jeong, Dongchul Han, Dong Ho Lee, Kyungwoon Lee, J. Kim, and Jung Ho Park "A broadband silicon electro-absorption modulator (EAM) using a Schottky diode", Proc. SPIE 8988, Integrated Optics: Devices, Materials, and Technologies XVIII, 89881M (8 March 2014); https://doi.org/10.1117/12.2038800

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