Thermal Processing Of Resist Materials: A Kinetic Approach

David H. Ziger; Gary L. Wolk

doi:10.1117/12.968322

1 January 1988 Thermal Processing Of Resist Materials: A Kinetic Approach

David H. Ziger, Gary L. Wolk

Proceedings Volume 0920, Advances in Resist Technology and Processing V; (1988) https://doi.org/10.1117/12.968322
Event: Santa Clara Symposium on Microlithography, 1988, Santa Clara, CA, United States

Abstract

A kinetic approach to thermal processing of labile resist materials is proposed which compensates for non-isothermal heat treatments, run to run thermal variations and batch loading effects. This technique was used to control ammonia catalyzed image reversal processing and allowed consistent definition of 0.5μm and 0.6μm linear features using a g-line stepper equipped with 0.42 and 0.35 NA lenses respectively.

Citation Download Citation

David H. Ziger and Gary L. Wolk "Thermal Processing Of Resist Materials: A Kinetic Approach", Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); https://doi.org/10.1117/12.968322

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