Directed self-assembly aware restricted design rule and its impact on design ability

Yulu Chen; Ryoung-han Kim

doi:10.1117/12.2219216

16 March 2016 Directed self-assembly aware restricted design rule and its impact on design ability

Yulu Chen, Ryoung-han Kim

Proceedings Volume 9781, Design-Process-Technology Co-optimization for Manufacturability X; 978104 (2016) https://doi.org/10.1117/12.2219216
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States

Abstract

Directed self-assembly (DSA), the epitaxial alignment of block copolymers to minimize the system free energy, is prone to defects that are random and difficult to eliminate. When creating fins for FinFET devices, the defect density is known to be a strong function of guide pattern CD. We propose the use of a restricted design rule (RDR) that limits the guide pattern CD to achieve low defectivity, and also report its impact on overall chip area and design-ability of logic, analog IO, and SRAM. The restricted design rule in defining guide pattern CD is extracted from empirical data. Design rule check (DRC) is applied to GLOBALFOUNDRIES' technology chip design to estimate the penalty of DSA RDR on fin layer.

Citation Download Citation

Yulu Chen and Ryoung-han Kim "Directed self-assembly aware restricted design rule and its impact on design ability", Proc. SPIE 9781, Design-Process-Technology Co-optimization for Manufacturability X, 978104 (16 March 2016); https://doi.org/10.1117/12.2219216

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