Conductor backed and shielded multi-layer coplanar waveguide designs on LTCC for RF carrier boards for packaging PICs

Philip J. Marraccini; Moises A. Jezzini; Frank H. Peters

doi:10.1117/12.2225962

13 May 2016 Conductor backed and shielded multi-layer coplanar waveguide designs on LTCC for RF carrier boards for packaging PICs

Philip J. Marraccini, Moises A. Jezzini, Frank H. Peters

Author Affiliations +

Proceedings Volume 9891, Silicon Photonics and Photonic Integrated Circuits V; 98911Q (2016) https://doi.org/10.1117/12.2225962
Event: SPIE Photonics Europe, 2016, Brussels, Belgium

Abstract

Designing photonic integrated circuits (PICs) with packaging in mind is important since this impacts the performance of the final product. In coherent optical communication applications there are a large number of DC and RF lines that need routed to connect the PIC to the outer packaging. These RF lines should be impedance matched to the devices, isolated from each other, low loss and protected against electromagnetic interference (EMI) over the frequency range of interest to achieve the performance required for the application. Multilevel low temperature co-fired ceramic (LTCC) boards can be used as a carrier board connecting the PIC to the packaging due to its good RF performance, machinability, compatibility with hermetic sealing, and ability to integrate drivers into the board. Flexibility with layer numbers enables additional layers for shielding against electromagnetic interference or increased space for routing electrical connections. In this paper the design, simulations, and measured results for a set of 4 phase matched transmission lines in LTCC that would be used with an IQ MZM are presented. The measured 3dB bandwidth for a set of four phase matched transmission lines for an IQ MZM was measured to be 19.8 GHz.

Conference Presentation

Citation Download Citation

Philip J. Marraccini, Moises A. Jezzini, and Frank H. Peters "Conductor backed and shielded multi-layer coplanar waveguide designs on LTCC for RF carrier boards for packaging PICs", Proc. SPIE 9891, Silicon Photonics and Photonic Integrated Circuits V, 98911Q (13 May 2016); https://doi.org/10.1117/12.2225962

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