Jason R. Grenierhttps://orcid.org/0000-0003-3833-8560,1 Lars Brusberg,1 Chad C. Terwilliger,1 Juergen Matthies,2 Jeffrey S. Clark,1 Daniel W. Levesque,1 Kristopher A. Wieland1
1Corning Research & Development Corporation (United States) 2Corning Optical Communications GmbH & Co. KG (Germany)
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Co-packaged optical modules aim to meet the increasing bandwidth and power reduction requirements in next-generation datacenter switches. Meeting the cost per capacity targets requires new and innovative wafer-scale manufacturing solutions. In this work, glass with low-loss (<0.1 dB/cm) single-mode ion-exchanged waveguides is proposed as an optoelectronic substrate for co-packaged optics. High-speed ultrafast laser processes are developed to fabricate through glass vias for electrical connections, ablated features to enable passive alignment of MPO-connector to chip coupling, and for the singulation of glass wafers into individual optical circuits with optical quality end-facets for low-loss edge coupling without subsequent post-polishing or finishing steps.
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Jason R. Grenier, Lars Brusberg, Chad C. Terwilliger, Juergen Matthies, Jeffrey S. Clark, Daniel W. Levesque, Kristopher A. Wieland, "Towards high-volume manufacturing of optoelectronic glass substrates for co-packaged optics," Proc. SPIE PC12427, Optical Interconnects XXIII, PC1242707 (9 March 2023); https://doi.org/10.1117/12.2651387