Emission engineering via the silicon nitride photonic platform

Kishor Kumar Mandal; Anuj Kumar Singh; Anshuman Kumar; Brijesh Kumar; Venu Gopal Achanta

doi:10.1117/12.3003155

13 March 2024 Emission engineering via the silicon nitride photonic platform

Kishor Kumar Mandal, Anuj Kumar Singh, Anshuman Kumar, Brijesh Kumar, Venu Gopal Achanta

Proceedings Volume PC12889, Integrated Optics: Devices, Materials, and Technologies XXVIII; PC1288917 (2024) https://doi.org/10.1117/12.3003155
Event: SPIE OPTO, 2024, San Francisco, California, United States

Conference Poster

Abstract

Silicon nitride (SiN) has emerged as a promising platform for the development of photonic integrated circuits (PICs) covering a wide range of application areas from the visible to the infrared regime. Optical microcavity has evolved to be a highly versatile component in PICs, enabling the development of various disciplines, including lasers, filters, sensors, tele/data communication, and quantum technologies. SiN microring resonators are particularly compatible with already established micro or nanofabrication protocols and display useful properties, such as ultra-compactness, low loss, and planar nature. In this work, we have demonstrated the hybrid nanophotonic chip modeling, nanofabrication, two-dimensional semiconductor (TMDC) integration, and chip testing of high-Q ultra-compact SiN microring resonators supporting the Terahertz (THz) free spectral range (FSR) cavity modes at the visible wavelength. Counterpart, the monolithic integration of solid-state color centers with photonic elements of the same material is a promising approach to overcome the constraints of fabrication complexity and coupling losses in traditional hybrid integration approaches. We have engineered a novel

Citation Download Citation

Kishor Kumar Mandal, Anuj Kumar Singh, Anshuman Kumar, Brijesh Kumar, and Venu Gopal Achanta "Emission engineering via the silicon nitride photonic platform", Proc. SPIE PC12889, Integrated Optics: Devices, Materials, and Technologies XXVIII, PC1288917 (13 March 2024); https://doi.org/10.1117/12.3003155

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